Electronics

Electronic systems generate increasing heat as power density, efficiency, and miniaturization continue to rise. Heatsinks used in the electronic market are designed to deliver reliable thermal performance across a wide range of power levels, environments, and operating lifecycles—while supporting high-volume manufacturing and cost targets.

Extruded Aluminum Heatsinks

Extruded aluminum heatsinks are the most common thermal solution in electronic equipment. Produced by forcing aluminum through a precision die, they provide an excellent balance of performance, cost, and scalability.

Key Benefits

• Cost-effective for low to high volumes
• Lightweight and corrosion resistant
• Consistent thermal performance

Applications

• Power supplies and power converters
• Industrial control electronics
• Networking and communication equipment
• Consumer and commercial electronics

Stamped Fin Heatsinks

Stamped fin heatsinks are formed from thin aluminum or copper sheets, making them suitable for compact and cost-sensitive electronic assemblies.

Key Benefits

• Low material and tooling cost
• Thin, space-efficient designs
• High-volume production capability

Applications

• Control boards and interface modules
• Low-power power electronics
• Compact electronic enclosures

Bonded Fin Heatsinks

Bonded fin heatsinks feature fins bonded or brazed to a base, allowing higher fin density and improved airflow compared to standard extrusions.

Key Benefits

• Higher heat dissipation capability
• Flexible fin geometry and spacing
• Improved thermal efficiency

Applications

• Power electronics modules
• Industrial computing systems
• Telecom and networking equipment

Active Heatsinks (Fan-Assisted)

Active heatsinks combine a finned heatsink with forced airflow from a fan to achieve significantly higher cooling performance.

Key Benefits

• High thermal performance in compact spaces
• Suitable for higher power densities
• Cost-effective alternative to liquid cooling

Applications

• Servers and data communication equipment
• Power inverters and converters
• Industrial electronics and embedded systems

Heat Pipe Heatsinks

Heat pipe heatsinks use sealed copper heat pipes to rapidly transport heat from the source to remote fin stacks, improving thermal efficiency.

Key Benefits

• Excellent heat transfer capability
• Handles high heat flux components
• Enables compact system layouts

Applications

• Industrial computers
• Networking and telecom equipment
• High-power electronic assemblies

Vapor Chamber Heatsinks

Vapor chambers are flat, two-phase heat spreaders that distribute heat evenly across the heatsink base, reducing hot spots.

Key Benefits

• Superior heat spreading
• Ideal for high power density electronics
• Improves overall system reliability

Applications

• High-performance computing electronics
• Advanced power electronics
• Compact electronic systems

Die-Cast Heatsinks

Die-cast heatsinks are manufactured by injecting molten aluminum into molds, allowing complex shapes and integrated mechanical features.

Key Benefits

• Complex geometry in a single component
• Good mechanical strength
• Consistent surface finish

Applications

• Power electronics housings
• LED lighting electronics
• Industrial electronic enclosures

Passive (Fanless) Heatsinks

Passive heatsinks rely on natural convection and radiation, making them ideal for electronics requiring silent operation and high reliability.

Key Benefits

• Zero noise and zero maintenance
• Long service life
• High system reliability

Applications

• Industrial sensors and controllers
• Monitoring and safety electronics
• Low-power electronic systems

Electronic Heatsink Solutions Overview