Top

Engineering Support

New CSI 25 / Engineering Support
engineering support

Engineering Support

At Cooling Source, engineering support is an integral part of every thermal solution we deliver. Our team works directly with customer engineering groups to solve complex heat dissipation challenges across electronics, power systems, and sealed enclosures—reducing development risk, accelerating time-to-market, and ensuring thermal compliance.

We support programs from early concept through final production using a structured, data-driven thermal engineering approach.

Scope of Engineering Support

Thermal Design & Architecture

We collaborate early in the design cycle to define the optimal thermal architecture based on:

  • Power dissipation and heat density
  • Mechanical envelope and height constraints
  • Airflow conditions (natural, forced, sealed)
  • Environmental and reliability requirements

Our engineers recommend the most effective combination of heatsinks, heat pipes, vapor chambers, cold plates, or heat exchangers based on real operating conditions—not assumptions.

Thermal Simulation & Analysis

We perform thermal simulation and modeling to predict system performance before hardware is built, including:

  • Steady-state and transient thermal analysis
  • Junction-to-ambient temperature prediction
  • Airflow optimization and pressure drop analysis
  • Heat spreading efficiency and interface resistance evaluation

Simulation allows rapid iteration, design optimization, and early identification of thermal risks—reducing costly prototype revisions.

Prototyping & Design Validation

We provide rapid prototyping to validate simulation results and support design decisions. Engineering support includes:

  • Custom and modified off-the-shelf prototypes
  • Instrumentation planning (thermocouples, IR imaging)
  • Correlation of test data to simulation models
  • Design refinements based on measured performance

This closed-loop process ensures thermal designs behave in the real world as predicted.

Thermal Testing & Qualification

Our in-house and partner testing capabilities support:

  • Heatsink and assembly thermal resistance characterization
  • Airflow and pressure drop testing
  • System-level temperature rise measurements
  • Application-specific qualification testing

Testing is conducted under realistic boundary conditions to ensure compliance with customer and industry requirements.

Applications We Support

Our engineering support is applied across a wide range of markets and applications, including:

  • Power electronics and power conversion
  • Industrial controls and automation
  • Telecom and networking equipment
  • Medical and laboratory electronics
  • Defense, aerospace, and ruggedized systems
  • Sealed and outdoor electronic enclosures

Engineering-Driven Results

By combining simulation, prototyping, and testing, our engineering team helps customers:

  • Reduce junction temperatures and improve reliability
  • Optimize thermal performance within tight mechanical constraints
  • Shorten development cycles
  • Minimize redesigns and qualification delays
  • Transition smoothly from prototype to production

Partner with Our Engineering Team

Whether you need early-stage thermal guidance, detailed simulation support, or full design validation, our engineering team works as an extension of yours—focused on performance, manufacturability, and long-term reliability.

Custom and standard heatsinks, cold plates, extruded, bonded fin, swaged, folded fin, heatpipe, die casting, zipper fin, cpu cooler, fans. Seattle, Portland, San Francisco, San Jose, Los Angeles, Orange County, San Diego, Sacramento, Denver, Salt Lake City, Dallas, Austin, Houston, Phoenix, Boston, New York, Chicago, Tampa, Miami, Minneapolis, Canada, Europe, Asia, Australia.

 

 

Contact us
Purchase our heatsinks

Follow on LinkedIn