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Extruded Push Pin heatsinks / Thermal Solutions

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Vibration-Resistant Thermal Solutions for High-Reliability Electronics

Cooling Source’s CS867 Series extruded push-pin pin-fin heatsinks are engineered for applications requiring mechanically secure attachment, repeatable thermal performance, and serviceability. The spring-loaded push-pin retention system maintains consistent interface pressure under shock, vibration, and thermal cycling—making these solutions well suited for mission-critical electronics.

Manufactured from high-conductivity aluminum with a black anodized finish, the pin-fin geometry provides omnidirectional airflow capability and low system pressure drop, supporting efficient cooling in constrained or unpredictable airflow environments.

ITAR-controlled and defense-grade programs can be supported through U.S.-based engineering oversight, controlled documentation, and compliant manufacturing pathways when required.

Best for: processors, power ICs, FPGAs, industrial and telecom electronics.

 

Engineering Advantages

  • Secure push-pin mounting resists loosening from vibration
  • Uniform spring-loaded contact pressure for stable thermal impedance
  • Pin-fin architecture supports forced or natural convection
  • Multiple fin heights for mechanical and thermal optimization
  • Reworkable attachment minimizes PCB risk during service or upgrades
  • Phase-change TIM improves interface consistency and repeatability

Defense & High-Reliability Applications

  • Ruggedized embedded computing
  • Communications and radar subsystems
  • Industrial and aerospace electronics
  • Control systems with vibration exposure
  • Long-life platforms requiring serviceability

Technical Summary (CS867 Series)

Material:

  • Aluminum extrusion (high thermal conductivity)
  • Black anodized surface finish

Thermal Design:

  • Extruded pin-fin geometry
  • Omnidirectional airflow compatibility
  • Optimized surface area for low pressure drop

Mounting Method:

  • Tool-less spring-loaded push pins
  • Even, repeatable mounting pressure
  • PCB-safe, reworkable attachment

Interface Material:

  • Factory-supplied phase-change thermal interface material (TIM)

Configuration Options:

  • Multiple fin heights
  • Standard off-the-shelf footprints
  • Custom variants available upon request

Availability:

  • Production-ready, short lead times
  • Volume manufacturing support available

 Comparison Table

Push-Pin Mount vs. Screw-Mounted Heatsinks

Feature / Criteria Push-Pin Mount Screw Mount
Installation Time Tool-less, fast installation Slower, requires torque tools
Mounting Pressure Spring-loaded, self-regulating Torque-dependent, operator-sensitive
Pressure Uniformity Consistent across installations Can vary with torque accuracy
Vibration Resistance Excellent (spring maintains preload) Good, but may loosen over time
Thermal Consistency Highly repeatable thermal impedance Can vary with torque and washer stack
Reworkability Easy removal and replacement Risk of PCB damage during rework
PCB Stress Low, compliant attachment Higher localized stress
Assembly Cost Lower (no tools, faster cycle time) Higher labor and tooling cost
Serviceability Excellent Moderate
Best Use Case High-volume, serviceable designs Permanent or heavy heatsinks

Summary:
Push-pin mounting offers greater consistency, lower assembly cost, and superior serviceability, while screw mounting is best reserved for heavy or permanent thermal assemblies.

Engineering Note

Why Choose Push-Pin Mounting Over Screw Mounting?

Push-pin heatsink mounting is preferred in modern electronics where repeatability, vibration tolerance, and manufacturability are critical.

Key engineering advantages:

  • Self-regulating preload
    Spring-loaded push pins maintain consistent contact force, compensating for PCB tolerances, thermal expansion, and material stack-up.
  • Improved thermal repeatability
    Eliminates torque variability that often leads to inconsistent thermal resistance in screw-mounted assemblies.
  • Reduced PCB risk
    No over-torque condition, minimizing board flex, pad damage, or micro-fractures—especially important for dense or thin PCBs.
  • Faster production and service cycles
    Tool-less installation reduces assembly time and simplifies field replacement or rework.
  • Superior vibration performance
    Maintains constant preload under shock and vibration, making push-pin solutions ideal for industrial, telecom, and ruggedized electronics.

When to choose screw mounting:

  • Very large or heavy heatsinks
  • Applications requiring rigid, permanent attachment
  • Systems with thick metal substrates or chassis mounting

Need help selecting the right push-pin heatsink?
Cooling Source’s engineers can assist with thermal modeling, airflow analysis, and product selection to ensure optimal performance for your application.

push pin heat sink