Bonded Heatsinks
Cooling Source manufacture bonded heatsinks with aluminum or copper metal sheets. In addition, by using an extrusion process. Consequently, the fins go through the epoxy, or a solder brazes process. that is to say, the fin is bonded to the base.
CSI’s design bonded heatsinks to help meet your needs. Should you have any questions, our knowledgeable consultants can discuss your specific needs and answer any questions you may have. Furthermore, It is essential to choose the right product for cost, delivery time, and effectiveness. Consequently, the choice you make can be crucial to your success.
Also, bonded heatsinks are suitable for high-power applications. In addition, they provide low thermal resistance. Furthermore, forced air cooling should be considered.
Benefits and characteristics:
– Better aspect ratio than thin fin extrusions
– Rohs compliant and high thermal conductivity epoxy, or soldered fins
– Fins can be as thin as 0.008. “
– Fins can be 2 inches or higher
– The solid mechanical bond between the base and the fins
– Excellent process for large heat sinks.
Applications for Bonded heatsinks include:
– Thermoelectric Modules – TECs
– Un-interruptible Power Supplies – UPSs
– Variable Speed Motor Controls
– AC Welding Switches
– Power Rectification Equipment
– Laser Power Supplies
– Traction Control Motor Drives
Bonded heatsinks are commonly used in various applications where efficient heat dissipation is required. Some of the key benefits and applications of bonded heatsinks are:
1. High thermal conductivity: Bonded heatsinks are typically made of materials with high thermal conductivity, such as aluminum or copper. This allows for efficient transfer of heat from the heat source to the fins.
2. Increased surface area: The fins on bonded heatsinks provide a larger surface area, which helps in dissipating heat more effectively. This is particularly useful in applications where space is limited or airflow is restricted.
3. Customizable design: Bonded heatsinks can be designed and manufactured in various shapes and sizes to suit specific application requirements. This flexibility allows for optimal heat dissipation in different scenarios.
4. Enhanced performance: By effectively dissipating heat, bonded heatsinks can help in improving the performance and reliability of electronic components. They prevent overheating, which can lead to reduced lifespan or malfunctioning of devices.
5. Wide range of applications: Bonded heatsinks are commonly used in electronic devices such as computer processors, power amplifiers, LED lights, power supplies, and motor controllers. They can also be found in automotive, aerospace, telecommunications, and industrial equipment.
When to use bonded heatsinks:
1. High power applications: Bonded heatsinks are particularly suitable for applications that generate a significant amount of heat, such as power electronics or high-performance computing systems.
2. Limited airflow: In situations where natural or forced airflow is restricted, bonded heatsinks can efficiently dissipate heat without relying heavily on air movement.
3. Space-constrained environments: Bonded heatsinks are often used in compact devices or systems where space is limited. Their compact design and high surface area enable effective heat dissipation within a small footprint.
4. High ambient temperatures: If the application operates in a high-temperature environment, bonded heatsinks can help maintain the desired operating temperature range for the components.
Overall, bonded heatsinks are a reliable and efficient solution for managing heat in various electronic and industrial applications.
CSI manufactures Bonded Heatsinks made of Aluminum and copper.
We have decades of experience in Bond Copper Fins into Aluminum.
Bases. Copper Fins are assembled in combination with Aluminum Fins to save cost and increase thermal performance in some applications.
Engineering Support
Briefly, as part of the bonded heatsink design work, our engineers apply advanced 3D modeling. Also, we are using cutting-edge CFD tools to optimize your bonded fin heatsink heat transfer project. In addition to bonded heatsinks, we provide our customers with a complete cooling solution to meet specific requirements in a timely and cost-effective manner. Also, you can count on our Mechanical Engineers to assist with bonded fin design change and reduce manufacturing costs.
Our fully equipped lab is available to valid your designs, testing, and inspect.
Our team can help you meet tight schedule requirements while allowing you to focus on your business’s core competencies.
Also, we stand by, ready to support your bonded fin heatsink project from concept to production globally.
Finally, a simple call or e-mail will put you in touch with the experts who have the answers you require.
Contact us
CALL US TODAY FOR A FAST FREE QUOTE: 925.292.1293.
Bonded fin heatsinks and swaged fin heatsinks are two different types of thermal management solutions that utilize different manufacturing techniques. Here’s a breakdown of the differences between them:
1. Manufacturing process:
– Bonded fin heatsinks: In this process, individual fins are bonded or attached to a base plate using methods like epoxy or soldering. The fins can be made from materials such as aluminum or copper.
– Swaged fin heatsinks: Swaging involves deforming the base material (usually aluminum) to create integral fins. This is achieved by applying pressure through a swaging tool, which forms the desired shape and pattern of the fins.
2. Fin density and height:
– Bonded fin heatsinks: These heatsinks typically have higher fin densities, meaning there are more fins per unit area. They can also have taller fins, allowing for increased surface area for heat dissipation.
– Swaged fin heatsinks: Swaging generally results in lower fin densities compared to bonded fins. The height of the fins is limited by the swaging process but can still provide effective heat transfer.
3. Thermal performance:
– Bonded fin heatsinks: Due to their higher density and taller fins, bonded fin heatsinks often offer better thermal performance in terms of heat dissipation capabilities.
– Swaged fin heatsinks: While they may have lower overall density, swaged fin heatsinks can still provide efficient cooling depending on their design and application requirements.
4. Cost and complexity:
– Bonded fin heatsinks: The bonding process used in these types of sinks may require additional manufacturing steps such as epoxy application or soldering, which can increase production costs.
– Swaged fin heatsinks: The swaging process allows for simpler manufacturing with fewer steps involved compared to bonding methods.This simplicity often translates into cost savings.
5.Design flexibility:
– Bonded Fin Heatsink : With bonded fin heatsinks, there is more flexibility in terms of design options. Fins can be customized and attached to specific areas of the base plate as needed for optimal heat dissipation.
– Swaged Fin Heatsink : Swaged fin heatsinks have limitations in terms of design flexibility since the fins are formed by deforming the base material. The pattern and shape of the fins are predetermined by the swaging process.
Both bonded fin heatsinks and swaged fin heatsinks have their advantages and applications. Bonded fin heatsinks are often preferred when higher thermal performance is required, while swaged fin heatsinks offer a cost-effective solution with simpler manufacturing processes. The choice between them depends on factors such as thermal requirements, cost considerations, design constraints, and application-specific needs.
There are several driving factors that may lead to the use of bonded fin heatsinks over extrusion heatsinks in certain applications. Here are some key considerations:
1. Thermal performance: Bonded fin heatsinks often offer better thermal performance compared to extrusion heatsinks. The ability to attach individual fins directly to a base plate allows for higher fin densities and taller fins, resulting in increased surface area for heat dissipation. This can be advantageous when dealing with high-power or densely packed components that require efficient cooling.
2. Customization and design flexibility: Bonded fin heatsinks provide greater design flexibility as fins can be customized and attached in specific areas of the base plate as needed. This allows for optimized heat dissipation tailored to the specific requirements of the application.
3. Compactness: Bonded fin heatsinks can achieve higher levels of compactness compared to extrusion heatsinks due to their ability to pack more fins into a given space without relying on predefined extrusion profiles.
4. Weight considerations: In some cases, bonded fin heatsinks may offer weight advantages over extrusion counterparts, especially when using lightweight materials such as aluminum or copper alloys.
5. Specific application requirements: Certain applications may demand unique geometries or complex shapes that are better suited for bonded fin heatsink manufacturing processes rather than standard extrusions.
6.Cost-effectiveness for low-volume production: For low-volume production runs where custom designs are required, bonded fin heatsinks can be more cost-effective compared to developing custom extrusions, which typically involve tooling costs and longer lead times.
It’s important to note that both bonded fin and extrusion heatsinks have their own strengths and suitability depending on the specific thermal management needs of an application. Factors such as power dissipation requirements, available space constraints, cost considerations, manufacturing capabilities, and overall system design should all be taken into account when selecting the appropriate type of heat sink.
